Electrical and Communications Engineering

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WT-85X 400 Lifetime scanner

• Method for the spacial measurement of bulk minority carrier recombination lifetime.
• Kelvin-probe for surfacepotential measurements.
• More information about the device.

Contact person Hele Savin / Elektronifysiikan laboratorio.

More information: Link to equipment list

DLS-83D Deep Level Spectrometer (DLTS)

• Deep impurities in semiconductors.
• More information about the device.

Contact person Hele Savin / Elektronifysiikan laboratorio.

More information: Link to equipment list

Hall-measurement system + cryostat

• T range 8 K - 300 K
• Semiconductor carrier concentration and mobility as a function of temperature and magnetic field (max. 1.3 T).
• More information about the device.

Contact persons: Sergey Novikov ja Heikki Holmberg / Elektronifysiikan laboratorio.

More information: Link to equipment list

Probe-station

• I-V and C-V measurements for semiconductor devices.
• HP4155A Semiconductor parameter analyser and HP4192A LF impedance analyser.

Contact person Antti Haarahiltunen / Elektronifysiikan laboratorio.

More information: Link to equipment list

NTegra Scanning Probe Microscope (SPM)

Morphology of surfaces by contact / semicontact AFM and STM

• Lateral Force Microscopy (LFM)
• Force Modulation Microscopy (FMM)
• Electrical SPM imaging (SKM, SRI, SCM, EFM)
• Magnefic Force Microscopy (MFM)
• Oxidation & scratching lithography


• max. sample size ca. 10 mm x 20 mm
• max. scanning area 14 µm
• res. 3 Å vertical
• diameter of probe tip ca. 10-100 nm


• Scanning head configuration for AFM, LFM, FMM and MFM:
• max. sample size 4" wafer
• max. scanning area 100 µm
• res. 1 nm vertical

Contact person Antti Säynätjoki / Optoelektroniikan laboratorio.

More information: Contact Antti Säynätjoki

Nanoscope IIE AFM

Morfology of hard surfaces.

• max. sample size ca. 5 mm x 5 mm
• max. scanning area 13 µm
• res. 3 Å vertical
• diameter of probe tip ca. 10-100 nm

Contact person Antti Säynätjoki / Optoelektroniikan laboratorio.

More information: atomi.hut.fi/facilities.php

PANalytical X'Pert PRO MRD

High resolution x-ray diffraction system.

• Cu x-ray tube. (1-7 crystals).
• Applications:
• Texture analysis
• Stress analysis
• Thin film analysis, XRR (Thickness and surface roughness)
• Crystalstructure analysis
• max 6" wafer.

Contact person Pasi Kostamo / Optoelektroniikan laboratorio.

More information: atomi.hut.fi/facilities.php

Optical spectroscopy

• Photoluminesence, photoreflectance, absorption etc.
• Spectroscopical measurements on wavelengths 260-3200 nm.
• Ttimedependent measurements (res. 30 ps) on 700-1300 nm.
• Excitation lasers: 2x Argon, HeCd, Verdi V10+frequency doubling, Ti-Sf, excimer, MIRA.
• Detectors: Si-, InGaAs-, PbS-, InAs-diodes, PMT, LN-Ge, Microchannel plate.

Contact person Marco Mattila / Optoelektroniikan laboratorio.

More information: atomi.hut.fi/facilities.php

Fein-Focus FXS-160.24 Transmission x-ray

• Voltage range: 10-160 kV.
• Current range: 0.01-1 mA.
• Magnification (geometrical) 1000x, Total 2200x.
• Detail detectability < 2 μm.

Contact person doc. Kari Lounatmaa / Elektroniikan valmistustekniikan laboratorio.

More information: www.ept.hut.fi/Facilities

Hitachi mi-scope hyper Acoustic microscope

• High-resolution linear motor scanner.
• Ultrasonic system: 1-230 MHz.
• Scan area: X = 300 mm, Y = 300 mm, Z = 50 mm.

Contact person doc. Kari Lounatmaa / Elektroniikan valmistustekniikan laboratorio.

More information: www.ept.hut.fi/Facilities

JEOL JSM-6335F Field Emission SEM

• Magnification: 10x - 500000x.
• Optimal resolution: 1.5 nm.
• Illumination current: 0.0001 - 2 nA.
• LINK x-ray microanalyzer (EDS).

Contact person doc. Kari Lounatmaa / Elektroniikan valmistustekniikan laboratorio.

More information: www.ept.hut.fi/Facilities

Other testing facilities

Mechanical testing:

• MTS 858 Table Top System: 0 - 100 N (± 0.05 N) tai 100 N - 1 kN (± 0.5 N).
• Furnace: Temperature range: -20° - +120°.
• Uniaxial: Tensile, Creep, Fatigue, Relaxation.
• Environmental, thermo-mechanical, etc. test methods for accelerated reliability testing available.

Contact person lab.eng. Pirjo Kontio / Elektroniikan valmistustekniikan laboratorio.

More information: www.ept.hut.fi/Facilities