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Electrical and Communications Engineering

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WT-85X 400 Lifetime scanner

Contact person Hele Savin / Elektronifysiikan laboratorio.

More information: Link to equipment list



DLTS

DLS-83D Deep Level Spectrometer (DLTS)

Contact person Hele Savin / Elektronifysiikan laboratorio.

More information: Link to equipment list



HALL

Hall-measurement system + cryostat

Contact persons: Sergey Novikov ja Heikki Holmberg / Elektronifysiikan laboratorio.

More information: Link to equipment list



Probe-station

  • I-V and C-V measurements for semiconductor devices.
  • HP4155A Semiconductor parameter analyser and HP4192A LF impedance analyser.

Contact person Antti Haarahiltunen / Elektronifysiikan laboratorio.

More information: Link to equipment list



AFM

NTegra Scanning Probe Microscope (SPM)

Morphology of surfaces by contact / semicontact AFM and STM

  • Lateral Force Microscopy (LFM)
  • Force Modulation Microscopy (FMM)
  • Electrical SPM imaging (SKM, SRI, SCM, EFM)
  • Magnefic Force Microscopy (MFM)
  • Oxidation & scratching lithography

  • max. sample size ca. 10 mm x 20 mm
  • max. scanning area 14 µm
  • res. 3 Å vertical
  • diameter of probe tip ca. 10-100 nm

  • Scanning head configuration for AFM, LFM, FMM and MFM:
    • max. sample size 4" wafer
    • max. scanning area 100 µm
    • res. 1 nm vertical

Contact person Antti Säynätjoki / Optoelektroniikan laboratorio.

More information: Contact Antti Säynätjoki



AFM

Nanoscope IIE AFM

Morfology of hard surfaces.

  • max. sample size ca. 5 mm x 5 mm
  • max. scanning area 13 µm
  • res. 3 Å vertical
  • diameter of probe tip ca. 10-100 nm

Contact person Antti Säynätjoki / Optoelektroniikan laboratorio.

More information: atomi.hut.fi/facilities.php



XRD

PANalytical X'Pert PRO MRD

High resolution x-ray diffraction system.

  • Cu x-ray tube. (1-7 crystals).
  • Applications:
      • Texture analysis
      • Stress analysis
      • Thin film analysis, XRR (Thickness and surface roughness)
      • Crystalstructure analysis
  • max 6" wafer.

Contact person Pasi Kostamo / Optoelektroniikan laboratorio.

More information: atomi.hut.fi/facilities.php



Optical spectroscopy

  • Photoluminesence, photoreflectance, absorption etc.
  • Spectroscopical measurements on wavelengths 260-3200 nm.
  • Ttimedependent measurements (res. 30 ps) on 700-1300 nm.
  • Excitation lasers: 2x Argon, HeCd, Verdi V10+frequency doubling, Ti-Sf, excimer, MIRA.
  • Detectors: Si-, InGaAs-, PbS-, InAs-diodes, PMT, LN-Ge, Microchannel plate.

Contact person Marco Mattila / Optoelektroniikan laboratorio.

More information: atomi.hut.fi/facilities.php



XRAY

Fein-Focus FXS-160.24 Transmission x-ray

  • Voltage range: 10-160 kV.
  • Current range: 0.01-1 mA.
  • Magnification (geometrical) 1000x, Total 2200x.
  • Detail detectability < 2 μm.

Contact person doc. Kari Lounatmaa / Elektroniikan valmistustekniikan laboratorio.

More information: www.ept.hut.fi/Facilities



AM

Hitachi mi-scope hyper Acoustic microscope

  • High-resolution linear motor scanner.
  • Ultrasonic system: 1-230 MHz.
  • Scan area: X = 300 mm, Y = 300 mm, Z = 50 mm.

Contact person doc. Kari Lounatmaa / Elektroniikan valmistustekniikan laboratorio.

More information: www.ept.hut.fi/Facilities



FESEM

JEOL JSM-6335F Field Emission SEM

  • Magnification: 10x - 500000x.
  • Optimal resolution: 1.5 nm.
  • Illumination current: 0.0001 - 2 nA.
  • LINK x-ray microanalyzer (EDS).

Contact person doc. Kari Lounatmaa / Elektroniikan valmistustekniikan laboratorio.

More information: www.ept.hut.fi/Facilities



Mechanical

Other testing facilities

Mechanical testing:

  • MTS 858 Table Top System: 0 - 100 N (± 0.05 N) tai 100 N - 1 kN (± 0.5 N).
  • Furnace: Temperature range: -20° - +120°.
  • Uniaxial: Tensile, Creep, Fatigue, Relaxation.
  • Environmental, thermo-mechanical, etc. test methods for accelerated reliability testing available.

Contact person lab.eng. Pirjo Kontio / Elektroniikan valmistustekniikan laboratorio.

More information: www.ept.hut.fi/Facilities



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